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OCP Conference Focus: Manufacturing and packaging have already expanded significantly, and the bottleneck for AI chips has shifted downstream, including memory, racks, power supply, etc.

OCP Conference Focus: Manufacturing and packaging have already expanded significantly, and the bottleneck for AI chips has shifted downstream, including memory, racks, power supply, etc.

``` Author: Bao Yilong Source: Hard AI The AI semiconductor industry is expected to witness another strong year of growth in 2026, but the investment logic in the AI hardware sector is undergoing a profound change. On October 20, a Morgan Stanley research report pointed out that over the past two
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