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TSMC's advanced packaging roadmap changes: CoWoS has a "longer lifecycle," and the next-generation CoPoS will arrive "at the earliest in Q4 2030."

TSMC's advanced packaging roadmap changes: CoWoS has a "longer lifecycle," and the next-generation CoPoS will arrive "at the earliest in Q4 2030."

``` TSMC's advanced packaging technology roadmap is undergoing major adjustments. The mass production timeline for CoPoS has been significantly delayed, elevating the strategic importance of CoWoS. This change will profoundly impact the investment logic of the entire semiconductor packaging supply chain. According to a DigiTimes report on Friday, due
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Strait of Hormuz negotiable, nuclear issue hard to resolve? US and Iran may turn to “interim memorandum + 60-day ceasefire extension”

Strait of Hormuz negotiable, nuclear issue hard to resolve? US and Iran may turn to “interim memorandum + 60-day ceasefire extension”

The US-Iran negotiations are quietly lowering their goals as core differences remain unresolved—shifting from seeking a comprehensive peace agreement to using a temporary memorandum to prevent renewed conflict. According to the latest media reports, two Iranian sources revealed that the talks held last weekend in Islamabad failed to achieve
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