Intel collaborates with Lens Technology to explore packaging solutions based on glass substrates.

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Intel and Lens Technology announced a strategic partnership on Friday, with both parties set to jointly explore and drive new technological advancements in the field of advanced semiconductor packaging.

Through this collaboration, the two companies plan to explore packaging solutions based on glass substrates, accelerating related technology research and development to help future computing platforms achieve: higher performance, greater interconnect density, and superior power efficiency.

Intel and Lens Technology will leverage their strengths in advanced semiconductor packaging, precision manufacturing, glass substrate R&D, and process innovation to meet the growing demands in artificial intelligence, data centers, and specialized computing applications.

Intel CEO Lip-Bu Tan said:

“As AI systems continue to push the boundaries of performance, scale, and efficiency, advanced packaging is becoming a key driver of semiconductor innovation.”

He stated that Intel has profound expertise in semiconductor architecture and advanced packaging technology, while Lens Technology possesses world-class capabilities in precision glass processing, laser manufacturing, and large-scale production.

Lens Technology founder and chairwoman Zhou Qunfei said:

“Lens Technology has established a leading position in the industry through advanced materials engineering and precision manufacturing capabilities, serving some of the most demanding technology companies worldwide.”

She noted that by combining Lens Technology’s expertise in glass materials, high-precision laser processing, and advanced manufacturing with Intel’s leadership in semiconductor design and packaging, the partnership is expected to accelerate innovation in advanced packaging technologies.

Through this collaboration, Intel and Lens Technology will explore cooperation in key manufacturing processes to facilitate the large-scale application of advanced semiconductor packaging technologies.

Both parties also believe there are further opportunities for collaboration in areas where their capabilities complement each other. Potential future directions include: components related to AI PCs,high-reliability server structures and thermal solutions for data centers,hardware platforms supporting AI robotics, smart industrial devices, and edge computing.

Intel and Lens Technology said this partnership will help both sides jointly advance the development of next-generation computing technologies and AI infrastructure.

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