Intel’s Chen Liwu puts a doctoral cap on Jensen Huang and simultaneously reveals: Collaborating with Nvidia on “exciting new products.”

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Intel and NVIDIA's strategic cooperation is accelerating in implementation. At a ceremony full of symbolic significance, the leaders of the two chip giants appeared together, sending out the latest signal of deepening collaboration to the public.

On May 10, Intel CEO Lip-Bu Tan personally placed an honorary doctorate cap on NVIDIA CEO Jensen Huang at the Carnegie Mellon University Class of 2026 commencement ceremony. During the ceremony, Lip-Bu Tan publicly stated that the two companies are jointly developing "exciting new products" and gave high recognition to Jensen Huang's contributions in accelerated computing and artificial intelligence.

This statement further confirms the substantial warming of the relationship between the two companies. NVIDIA has previously announced a $5 billion investment in Intel, with the scope of collaboration covering both data centers and consumer platforms, involving custom processors, advanced packaging, and foundry manufacturing in several core areas.

Custom Xeon and Consumer SoC: Product Cooperation Roadmap Emerging

According to previous reports, there is already a relatively clear roadmap for product-level collaboration between Intel and NVIDIA. On the data center side, the two parties plan to co-develop a custom Xeon processor integrated with NVIDIA's NVLink interconnect technology to meet the demand for high-speed chip-to-chip communication in large-scale AI infrastructure.

In the consumer market, the two sides plan to integrate NVIDIA's RTX graphics IP into Intel's next-generation system-on-chip (SoC). The first product with this solution, codenamed "Serpent Lake," is expected to debut as early as 2028 to 2029. If this layout comes to fruition, it will have a profound impact on the current PC graphics market landscape.

Foundry Business: Intel’s Hidden Opportunity

Beyond product collaboration, Intel Foundry may contain even greater strategic value. NVIDIA has long relied on TSMC to produce its core data center chips, but TSMC has continued to face pressure in its CoWoS advanced packaging capacity, making it difficult to fully meet NVIDIA's rapidly rising wafer order demand.

Against this background, Intel’s foundry business is becoming an important option for NVIDIA to seek diversified capacity. Intel has recently secured foundry orders from TeraFab and Apple, which the market sees as key milestones in restoring external customer confidence in its foundry business, and has also laid a foundation for attracting major clients like NVIDIA.

Currently, market rumors indicate that NVIDIA’s next-generation GPU, codenamed "Feynman," may adopt Intel's EMIB advanced packaging solution. In addition, there are reports that Intel’s 18A-P or 14A process nodes may be used to produce certain NVIDIA GPUs, possibly including entry-level to mid-range consumer products for the gaming market.

Two Giants Align, Market Awaits Official Announcement

The joint appearance of Lip-Bu Tan and Jensen Huang at the ceremony is not only a public demonstration of personal friendship, but is also interpreted as a public endorsement of the two companies’ accelerated strategic coordination. With NVIDIA’s $5 billion investment finalized and the product collaboration roadmap becoming clearer, the market’s expectations for an official joint announcement are rising.

Currently, neither company has given official confirmation of specific product details. But from foundry capacity cooperation to chip IP integration, the scope of Intel and NVIDIA’s collaboration continues to expand. As Lip-Bu Tan said, "This journey has just begun," and the world will soon witness the concrete results of these two technology giants’ collaboration.

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