Market misjudgment? Report: TSMC's first-generation CoPoS may not use glass substrates, and has never considered using glass interposers.

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Market discussions surrounding TSMC’s CoPoS advanced packaging technology have recently intensified, and Taiwan’s technology stocks have entered an unusually speculative and active phase as a result.

According to several core supply chain sources interviewed by Taiwan Tech, there is significant deviation in the market’s interpretation of the CoPoS technology roadmap, particularly focusing on whether glass substrates are a necessary component of the first-generation product.

The interviewed individuals all expressed strong dissatisfaction with the current widespread rumors. The market generally regards glass substrates as an indispensable core material for CoPoS, but the technical route of the first-generation CoPoS very likely did not adopt glass substrates.

TSMC has also never considered glass interposers. CoPoS is expected to enter mass production in the first half of 2029.

Samsung Electro-Mechanics (SEMCO), Toppan from Japan, as well as other substrate manufacturers from Korea and Japan, have joined the research and development competition for glass core substrates and have recently started submitting engineering samples to TSMC.

The glass interposer is located between the chip and the packaging substrate, serving as the high-speed interconnection for chips such as GPU and HBM. The glass core substrate is located below the interposer, serving as the load-bearing substrate for the entire package, providing mechanical support and connecting to the PCB.

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