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Chip inflation is spreading, and Morgan Stanley predicts that "backend packaging and testing plants" will raise prices in 2026, for the first time since the pandemic.

Chip inflation is spreading, and Morgan Stanley predicts that "backend packaging and testing plants" will raise prices in 2026, for the first time since the pandemic.

``` Author: Xu Chao Source: Hard AI   Morgan Stanley says the wave of semiconductor inflation that began with foundries and memory is now spreading downstream. OSAT (Outsourced Semiconductor Assembly and Test) providers are preparing for the first price-increase cycle since the Covid-19 pandemic. Morgan Stanley warns that strong demand for AI
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