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Intel and AU Optronics are collaborating on advanced packaging for Micro LED, targeting the market for CPO and high-density computing power integration.

Intel and AU Optronics are collaborating on advanced packaging for Micro LED, targeting the market for CPO and high-density computing power integration.

Intel is extending its advanced packaging strategy to the field of Micro LED substrates and is reportedly collaborating deeply with AU Optronics, a major Taiwanese panel manufacturer, to jointly promote the integration of CPO (Common Packaging Optics) and high-density computing chips. This signifies that the optoelectronic heterogeneous integration technology route
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