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Intel and AU Optronics are collaborating on advanced packaging for Micro LED, targeting the market for CPO and high-density computing power integration.

Intel and AU Optronics are collaborating on advanced packaging for Micro LED, targeting the market for CPO and high-density computing power integration.

Intel is extending its advanced packaging strategy to the field of Micro LED substrates and is reportedly collaborating deeply with AU Optronics, a major Taiwanese panel manufacturer, to jointly promote the integration of CPO (Common Packaging Optics) and high-density computing chips. This signifies that the optoelectronic heterogeneous integration technology route
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Storage supercycle intensifies: DRAM/NAND prices rose 20-30% quarter-on-quarter in Q3, with hyperscale customers signing contracts to accept price increases in Q1 of next year.

Storage supercycle intensifies: DRAM/NAND prices rose 20-30% quarter-on-quarter in Q3, with hyperscale customers signing contracts to accept price increases in Q1 of next year.

The memory chip shortage has not eased, and cloud providers have already secured higher-priced contracts for next year. On September 19, according to the TrendFun trading platform, Bank of America Securities analyst Simon Woo released the latest memory industry research report. Channel research confirmed that the average price of DRAM
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