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``` Federal Reserve Chairman Walsh sent signals less hawkish than the market expected, dampening speculation of rate hikes within the year. Gold immediately extended its rebound, regaining its footing above $4,000 per ounce. On Thursday, spot gold rose 0.66% to $4,057 per ounce, ending a two-day losing streak.

``` The World Cup may provide extra support for U.S. employment data in June. Goldman Sachs estimates that the event will increase non-farm payrolls by about 40,000, making Thursday's employment report stronger than market expectations. According to CNBC's Thursday report, economists surveyed by Dow Jones

The productivity boost brought by AI may be real, but the speed at which it enters macro data may not align with the market's most optimistic timeline. Experience from the information and communication technology (ICT) revolution shows that new technologies often have significant time lags from commercialization, investment

July 1st, Bloomberg broke the news: Meta is internally advancing a project codenamed “Meta Compute,” planning to sell excess AI computing power to external clients. Two paths are being pursued simultaneously: - Managed model access — opening up models like Llama and Muse Spark to enterprise clients, charging by token usage,

A piece of news about Meta selling excess computing power has simultaneously put several of the most sensitive issues in AI trading on the table: **is computing power really in shortage, will Meta lower its capital expenditure, and how long can Neocloud keep making money?** [Wallstreet.cn mentions](https://wallstreetcn.

Nomura Securities believes that Korea’s June export data looks like a celebration, but beneath the high numbers, internal structural cracks are already showing. WallstreetCN article previously reported that South Korea’s exports in June soared 70.9% year-on-year to $102.25 billion, breaking the $100 billion mark in a

On July 1st, according to renowned semiconductor analytics firm SemiAnalysis, Google's next-generation TPU, codenamed Humufish, will abandon TSMC's CoWoS packaging and instead adopt Intel's EMIB-T technology. Currently, TSMC's CoWoS is the industry's default standard for AI chip packaging. As a