TSMC's packaging monopoly quietly loosens: SK Hynix teams up with Intel to test EMIB technology, AI chip supply chain may see major changes
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The structural tension in the AI chip packaging supply chain is driving the emergence of new technological cooperation models.
According to reports, as TSMC’s CoWoS packaging capacity continues to be in urgent demand, South Korean memory giant SK Hynix has turned to Intel, with the two sides developing R&