Report: Samsung and Nvidia expand cooperation, negotiations have extended to HBM5 and next-generation Groq chips

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Samsung Electronics and NVIDIA are pushing their bilateral cooperation to new depths, with negotiations expanding from current product lines to next-generation high bandwidth memory and chip foundry, marking a further strengthening of the strategic binding of these two tech giants in the AI infrastructure supply chain.

According to TrendForce News on Tuesday, Samsung Electronics Vice Chairman Jun Young-hyun had a meeting with NVIDIA CEO Jensen Huang on June 8, where the two discussed potential collaboration in HBM and foundry services.

Jun Young-hyun stated that the top priority recently is to ensure stable supply of HBM4 and SOCAMM this year. Meanwhile, the parties have also discussed long-term cooperation starting next year, covering HBM4E, foundry services, and HBM5.

This meeting took place after Jensen Huang’s high-profile visit to Korea and a series of meetings with SK Hynix, which has raised considerable attention on whether Samsung can consolidate its position in NVIDIA’s supply chain. Jun Young-hyun did not confirm whether the two parties will sign a long-term memory supply agreement, but according to Newspim, he stated that Samsung will spare no effort to support NVIDIA’s success as an important partner.

Foundry Collaboration Extends to Next-Generation Groq Chips

In the foundry business, the scope of cooperation between Samsung and NVIDIA is expanding. Samsung is negotiating with NVIDIA to use advanced process nodes for the production of next-generation chips, involving Drive AGX Thor autonomous driving chips and Groq language processing units (LPU).

Jun Young-hyun stated that Samsung currently produces autonomous driving and Groq chips for NVIDIA using 4nm and 8nm process nodes, and the cooperation also extends to next-generation Groq chips. Samsung is currently using 4nm to produce the third-generation Groq LPU (LP30). Jun Young-hyun’s remarks indicate that Samsung also has the capability to produce the next-generation LP40—even though the industry had broadly expected TSMC to secure the order due to its advanced packaging advantage.

NVIDIA CEO Jensen Huang also commented on the cooperation at the NVIDIA Korea AI ecosystem reception. According to Dealsite, Huang stated that NVIDIA and Samsung have had long-term cooperation in the ASIC field, are currently jointly developing new ASIC products, and have a lasting partnership in memory technology.

Memory Supply Covers All Vera Rubin Platform Products

In the memory business, Samsung has already provided NVIDIA’s Vera Rubin platform with multiple products. Samsung is supplying sixth-generation HBM4 memory for the platform, with a data transfer rate of 11.7 Gbps; meanwhile, it provides SOCAMM2 modules based on LPDDR5X for the Vera CPU, and PM1763 storage solutions based on PCIe Gen6.

For next-generation products, Samsung’s HBM4E combines a DRAM core chip with a self-developed 4nm foundry base chip, achieving transfer speeds of 14 Gbps, with up to 16 Gbps in tests. If these specifications enter mass production smoothly, it will help Samsung compete more directly with SK Hynix in the high-end HBM market.

Long-term Agreement Unresolved, Cooperation Framework Still Forming

Despite the expanding scope of cooperation, the key long-term supply agreement has not yet been finalized. Jun Young-hyun did not give a direct confirmation when asked whether they will sign a long-term memory supply agreement, responding with relative caution.

Overall, this meeting covers multiple aspects, including HBM4, HBM4E, HBM5, foundry processes, and ASIC joint development, showing that the cooperation between the two parties is evolving from single product procurement to deeper technical collaboration. For investors, whether Samsung can successfully secure the LP40 foundry order and further enhance its share in the HBM supply chain will be the key indicators to measure the substantive progress of this round of cooperation.

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