Report: SK Hynix subsidiary Solidigm is considering building its first NAND flash memory factory in the United States.

SK Hynix's NAND flash memory manufacturing footprint may be poised for further expansion. Solidigm, SK Hynix's NAND business platform, is considering building its first NAND mass production line in the United States, extending its existing manufacturing capabilities further into the country.

On September 18, citing sources familiar with the matter, it was reported that Solidigm is considering a site selection on the US East Coast and discussing details such as product portfolio and mass production timelines. However, the final investment scale and construction plan still depend on the progress of negotiations with customers on long-term agreements (LTAs). Solidigm was established after SK Hynix acquired Intel's NAND flash memory business in 2021 and is currently primarily responsible for related NAND business.

This move echoes SK Hynix's recent assessment of its US memory chip manufacturing plans. According to a previous article by Wall Street Insights , on September 16th, it was reported that SK Hynix was in talks with Intel about a collaboration to produce memory chips in the US, but the company subsequently stated that no specific partner had been identified, nor had any concrete plans for producing memory chips in the US been finalized.

The demand from AI data centers has become a key factor driving NAND manufacturers to restructure their production capacity. TrendForce data shows that in the second quarter of 2026, SK Hynix and Solidigm's NAND revenue reached $14.2729 billion, an 89.5% increase quarter-over-quarter. With the expansion of AI server deployments and the growth in model size and data processing volume, the demand for high-capacity SSDs in data centers continues to rise, and Solidigm is also adjusting its production capacity layout to meet this demand.

As AI storage demand heats up, Solidigm explores domestic production capacity in the United States.

Solidigm has long focused on QLC NAND for the data center market. Compared to TLC, which stores three bits per cell, QLC can store four bits, giving it a cost advantage in the high-capacity SSD field and making it more suitable for data centers' needs for high-capacity, low-cost storage.

As AI servers scale up, the amount of data that data centers need to process and store continues to increase, thus enhancing the importance of high-capacity SSDs. For Solidigm, the core driver for new capacity additions in the US remains customer demand. Specific products and mass production timelines are not yet finalized, and the progress of long-term supply agreement negotiations will directly impact investment decisions.

From SK Hynix's overall strategic plan, the company has already been advancing the construction of advanced packaging facilities in the United States and has been continuously evaluating the possibility of expanding its local manufacturing capabilities. SK Group Chairman Chey Tae-won stated at the SK Hynix ADR listing event in New York in July that, in addition to the advanced packaging facility in Indiana, the company is evaluating the possibility of further investment; building a memory chip manufacturing plant in the United States is also a feasible option if conditions such as electricity, water, labor, and supply chain are met.

Currently, SK Hynix has not finalized its US memory chip production plans, while Solidigm's recent reports that it is considering building its own NAND production line indicate that its US manufacturing strategy is moving from discussion to concrete evaluation. Furthermore, Solidigm is preparing for a Nasdaq IPO, and if its US domestic production capacity is ultimately established, it could become a crucial component of its future expansion.

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