Samsung: Has already started shipping HBM4 to customers

Samsung: Has already started shipping HBM4 to customers

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According to Bloomberg, Samsung Electronics announced on Thursday that it has begun commercial shipments to customers of its latest generation HBM4 memory chips, marking a strategic lead in the fiercely competitive AI memory chip market.

This is an important milestone for Samsung. The company is racing to meet the strong demand for Nvidia graphics chips, which are the most advanced accelerators for training and running AI models. High-bandwidth memory chips are an indispensable component of AI accelerators.

Previously, competitor SK Hynix held the technological lead and dominated Nvidia’s high-bandwidth memory chip orders. However, in recent months, Samsung has narrowed this gap.

Performance Significantly Surpasses Industry Standards

Samsung’s HBM4 achieves a remarkable breakthrough in performance metrics over industry standards. From the outset of R&D, Samsung set its target to surpass JEDEC (Solid State Technology Association) performance standards, adopting 1c DRAM technology and a 4-nanometer wafer foundry process.

Thanks to this process combination, Samsung HBM4’s data processing speed reaches 11.7 Gbps, about 37% higher than the JEDEC standard of 8 Gbps, and 22% faster than the previous generation HBM3E’s 9.6 Gbps. The bandwidth of a single stack reaches 3 TB/s, 2.4 times that of the previous generation product.

Utilizing a 12-layer stacking technology, Samsung HBM4 can provide 36 GB of capacity, and with a future 16-layer stack, capacity can be expanded to 48 GB.

While enhancing computing performance, this product adopts a low-power design, which is expected to help data centers reduce electricity consumption and cooling costs. This is of significant importance for companies operating large-scale AI infrastructure.

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