Stock price hits new high! SK Hynix begins shipping 12-layer HBM4E samples
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SK Hynix announced the delivery of next-generation AI memory chip HBM4E samples to major customers, driving the company’s stock price to a new all-time high.
On Thursday, SK Hynix stated on its official website that the 12-layer stacked HBM4E product offers a maximum data processing speed of 16Gbps per pin, with power efficiency improved by over 20% compared to the previous generation, and advanced packaging technology reduces thermal resistance by 17%. SK Hynix said it will closely collaborate with partners to ensure the timely mass production of the product.
The sample shipment marks another acceleration in SK Hynix’s technological iteration in the high-bandwidth memory field, further solidifying its core role in the AI infrastructure supply chain and providing the latest signal of the company’s continued leadership in the HBM technology roadmap.
After the announcement, SK Hynix stock rose 7.3% during trading on the Korea Exchange, setting a new intraday record high. This increase reflects the market’s strong expectations for SK Hynix’s continued leadership in the AI memory sector. From HBM3 and HBM3E to HBM4, SK Hynix has established a complete delivery capability from mass production to supply, and the timely shipment of HBM4E samples further reinforces investor confidence in its technological execution capabilities.
Dual Leap in Performance and Efficiency
SK Hynix disclosed in its statement that the 12-layer HBM4E achieves significant advancements in both performance and power efficiency.
Specifically, the product offers a maximum data processing speed of 16Gbps per pin, with power efficiency improved by over 20% compared to previous products. At the same time, HBM4E leverages the latest interface design and optimization, effectively lowering data transmission latency while maintaining stable operation in high bandwidth environments. These features directly enhance data processing capabilities in AI training and inference scenarios, helping customers improve operational efficiency in AI data centers and large-scale computing systems.
Advanced Packaging Technology Supports 48GB Capacity
In terms of packaging process, SK Hynix uses Advanced MR-MUF (Mass Reflow Molded Underfill) technology, achieving a single-chip capacity of 48GB with a 12-layer stacked structure, while ensuring structural stability.
The MR-MUF process protects circuits by injecting liquid protective material between chips. SK Hynix further optimized this process, enabling HBM4E’s thermal resistance to be reduced by 17% compared to the previous generation HBM4, ensuring stable operation of memory chips in high-performance computing environments. This technical breakthrough is especially crucial for AI data centers operating under continuous heavy loads.
SK Hynix President and Chief Development Officer Ahn Hyun stated: "SK Hynix, with market-leading technical capabilities and manufacturing expertise, has laid the foundation for strengthening AI leadership with HBM4E. Through close collaboration with partners, we will deliver needed value to the market and further solidify our technical leadership as a full-stack AI memory creator."
SK Hynix emphasized that the company's rich experience in mass production and supply of HBM3, HBM3E, and HBM4 is an important foundation for the timely delivery of HBM4E samples. The company stated it will rely on market-proven product reliability and supply capacity to support the development of next-generation infrastructure and assist in addressing AI system performance bottlenecks.
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