TSMC CEO: Advanced process capacity is "not enough, not enough, still not enough"; current capacity is still short by a factor of three!

According to media reports on Tuesday, as AI computing power drives a rapid surge in demand for advanced process technologies, TSMC CEO C.C. Wei bluntly stated that the capacity for advanced processes is "not enough, not enough, still not enough," and revealed that according to major customers' product planning and growth expectations, the current capacity is still about three times short.

Last week, C.C. Wei and former Chairman Mark Liu jointly received the Semiconductor Industry Association's highest annual honor—the "Robert N. Noyce Award." This marks the second time TSMC's past and present leaders have simultaneously received the award, following founder Morris Chang's win in 2008.

The awards ceremony was held on the 20th (US West Coast time) in San Jose, California, with AMD Chair and CEO Lisa Su personally presenting the honors. The three on stage together were seen as the best embodiment of the core strength of the AI chip supply chain.

U.S. Secretary of Commerce Howard Lutnick sent greetings via a pre-recorded video, stating frankly, "Your leadership at TSMC has changed the world," driving advances in manufacturing and global technological progress. This highlighted TSMC’s increasingly crucial role in the global supply chain amid rising AI computing demand.

Customer Demand Far Exceeds Expectations

In his speech at the ceremony, C.C. Wei talked about the AI-driven demand for advanced processes, directly pointing out that customer needs far exceed expectations. He revealed that, based on major customers’ product planning and growth forecasts, TSMC's current capacity is still about three times short. He even joked that he wanted to wear a T-shirt with the words "No more wafer" on stage, implying that wafer demand is so strong it's hard to digest, which became one of the night's most talked-about remarks.

TSMC stated that this award represents the world’s high recognition of the company’s long-term contributions to advanced process technology, advanced packaging, and the manufacturing ecosystem. From 7nm, 5nm, 3nm, to the upcoming 2nm, TSMC has crossed multiple technical nodes in the past decade and has accelerated fab construction in the US, Japan, and Europe, making its global manufacturing footprint the foundation of the AI era.

In their speeches, C.C. Wei and Mark Liu both looked back on nearly thirty years of working together and emphasized that this honor belongs to the entire TSMC team.

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