TSMC plans to start producing 3-nanometer chips in Japan in 2028.

TSMC officially confirms plans to produce 3-nanometer chips in Japan in 2028.

On Tuesday, March 31, according to documents disclosed by TSMC, the company's second plant in Japan will adopt advanced 3-nanometer process technology, with a planned monthly production capacity of 15,000 12-inch wafers.

This plan was already revealed in February this year by TSMC CEO C.C. Wei during his meeting with Japan’s Prime Minister Sanae Takaichi, and the submission of these documents further solidifies the relevant details.

TSMC established its Japanese subsidiary "Japan Advanced Semiconductor Manufacturing" (JASM) in 2021. Initially supported by Sony Semiconductor Solutions Corporation, the company was later joined by DENSO and Toyota as minority shareholders.

Strategic Shift from Mature Processes to Advanced Processes

Previously, TSMC’s operations in Japan mainly focused on mature process technology.

According to the plan announced in 2024, the combined monthly production capacity of TSMC's first and second Japanese plants will reach 100,000 12-inch wafers, using process technologies such as 40nm, 22/28nm, 12/16nm, and 6/7nm. The total investment in both plants exceeds $20 billion.

The release of this revised plan means the technical positioning of the second plant has been adjusted. It has been upgraded from the originally planned mature process to the advanced 3-nanometer process, which aligns with TSMC’s recent global strategy to accelerate deployment of advanced process production capacity.

TSMC’s first Japanese plant began mass production at the end of 2024 and progress is going smoothly. If plans proceed, the second plant will start operations in 2028.

According to previous reports from Japanese media, investment in the second plant in Japan will be around $17 billion, but TSMC has not yet disclosed specific figures.

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