TSMC plans to start trial production of advanced processes below 1nm in 2029, with Apple expected to be the first to adopt them.

``` TSMC is pushing semiconductor manufacturing processes to new extremes. According to reports, the world’s largest chip foundry has already included sub-nanometer processes in its mass production roadmap, with trial production expected in 2029. Apple is highly likely to become one of the first customers. According to DigiTimes, as TSMC continues to promote the mass production of the 2nm node, it has mapped out a complete technology roadmap covering both current and advanced processes. According to this roadmap, TSMC plans to begin large-scale mass production of the 1.4nm process (code-named A14) in 2028. This process is expected to achieve up to a 30% improvement in both performance and energy efficiency. Trial production of the sub-nanometer process will follow in 2029, with an initial monthly output target of 5,000 wafers. This technological path holds great significance for Apple. Apple is expected to launch the iPhone 18 series with 2nm chips this year, marking the debut of TSMC's A20 and A20 Pro processes. If the sub-nanometer process progresses as scheduled, Apple is poised to integrate this cutting-edge technology into its flagship product line in a few years, maintaining its generational lead in mobile chips. Roadmap Unveiled: From 2nm to Sub-nanometer TSMC’s current technology roadmap is well-structured. The mass production of the 2nm process is underway to meet the demands of major customers, including Apple. Customer order fulfillment plans for the 1.6nm node (code-named A16) are also in place. In 2028, the 1.4nm process will enter large-scale mass production, promising significant improvements in both performance and power consumption. The sub-nanometer process represents the biggest technical challenge on this roadmap. The report did not specify potential customers for this ultra-advanced node, but given Apple’s long-standing exclusive and deep cooperation with TSMC, it is widely expected that Apple will be an early adopter. Production Capacity Layout: Multi-plant Collaboration for Trial Production To drive the implementation of the sub-nanometer process, TSMC plans to mobilize its A10 campus in Tainan and coordinate operations among four plants, P1 through P4, to achieve the initial monthly output goal of 5,000 wafers. Meanwhile, surging demand for AI chips has put pressure on TSMC’s production capacity, which is one of the key factors driving the company to accelerate its production rhythm and lock in orders ahead of time. The strong market demand for iPhones should not be ignored either—past experience shows Apple has paid a premium to secure supply priority, a situation likely to recur in the initial batches of sub-nanometer nodes. Yield Rate Concerns: Tough Battle Ahead Before Mass Production Although the roadmap is clear, whether TSMC can achieve stable, large-scale mass production of the sub-nanometer node as planned will still depend on solving yield issues. There is currently a rumor circulating in the market that, constrained by yield pressures, smartphone manufacturers are being forced to adopt downgraded chips for their flagship models, reserving the most advanced chips for "Ultra" series high-end devices. If this trend materializes, it will directly impact product positioning strategies—consumers may have to pay a higher premium for devices equipped with top-tier node chips, rather than seeing it as a standard flagship configuration. For investors, whether TSMC can effectively manage yield rates while expanding capacity will be a key variable in evaluating its long-term profitability. Risk Warning and Disclaimer The market has risks, and investment requires caution. This article does not constitute personal investment advice and has not considered the individual investment goals, financial situation, or needs of any particular user. Users should consider whether any opinions, views, or conclusions in this article are suitable for their specific circumstances. Investing accordingly is at your own risk. ```