AI material shortage spreads: NVIDIA steps in to purchase HVLP4 copper foil, gap to reach 1500 tons by 2026
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The demand for AI infrastructure continues to expand, and the high-end PCB supply chain is facing a new round of upstream bottlenecks. After T-glass fiberglass cloth, HVLP4 copper foil is becoming the most critical supply constraint for the second half of 2026. The market expects a shortage of 1,500