After two years, SK Hynix and TSMC leaders meet again to discuss cooperation in HBM and advanced packaging fields.
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As the deep integration of the AI chip supply chain accelerates, the cooperation between the two giants in memory and wafer foundry is extending from the product level to the strategic level.
SK Group Chairman Chey Tae-won held a meeting with TSMC Chairman C.C. Wei on the 4th, the