HBM packaging technology undergoes changes: Samsung and SK Hynix both delay the introduction of HBM hybrid bonding.
Samsung Electronics and SK Hynix are re-examining the timeline for the adoption of hybrid bonding technology in the high-bandwidth memory (HBM) sector. As HBM thickness standards are gradually relaxed and alternative cooling solutions emerge, the commercialization node of this next-generation packaging technology—which was originally highly anticipated—has been repeatedly