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Market misjudgment? Report: TSMC's first-generation CoPoS may not use glass substrates, and has never considered using glass interposers.

Market misjudgment? Report: TSMC's first-generation CoPoS may not use glass substrates, and has never considered using glass interposers.

``` Market discussions surrounding TSMC’s CoPoS advanced packaging technology have recently intensified, and Taiwan’s technology stocks have entered an unusually speculative and active phase as a result. According to several core supply chain sources interviewed by Taiwan Tech, there is significant deviation in the market’s interpretation of the
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