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From the “Chip Olympics” to the future of AI chips: Interconnect technology bottlenecks emerge, and packaging innovation becomes the next main battlefield

From the “Chip Olympics” to the future of AI chips: Interconnect technology bottlenecks emerge, and packaging innovation becomes the next main battlefield

The annual top-tier circuit conference ISSCC 2026, dubbed the "Chip Olympics" of the semiconductor industry, has released a batch of technologies with direct market significance—Samsung's HBM4 performance data is revealed for the first time, the optical interconnect roadmaps of Nvidia and Broadcom are becoming clearer,