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This year's Semiconductor highlights: Advanced packaging evolves towards 3D system integration; CPO manufacturing bottlenecks lie in testing...

This year's Semiconductor highlights: Advanced packaging evolves towards 3D system integration; CPO manufacturing bottlenecks lie in testing...

With the continuous expansion of AI computing power, the logic of semiconductor capacity expansion is extending from chip and wafer manufacturing to advanced packaging, optical interconnects, and testing. During SEMICON Taiwan 2026, research by Citi, Nomura, and UBS revealed six highlights of this year's exhibition: advanced packaging is
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