Report: SK Hynix is exploring new HBM4 packaging technologies, aiming at Nvidia's top performance targets.
SK Hynix is developing an innovative packaging technology for next-generation high-bandwidth memory, aiming to break through HBM4 performance bottlenecks without significantly increasing capital expenditures.
According to TrendForce citing ZDNet on Tuesday, industry sources revealed that SK Hynix is advancing an improved packaging architecture scheme, with core measures including increasing DRAM