TSMC's advanced packaging roadmap changes: CoWoS has a "longer lifecycle," and the next-generation CoPoS will arrive "at the earliest in Q4 2030."
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TSMC's advanced packaging technology roadmap is undergoing major adjustments. The mass production timeline for CoPoS has been significantly delayed, elevating the strategic importance of CoWoS. This change will profoundly impact the investment logic of the entire semiconductor packaging supply chain.
According to a DigiTimes report on Friday, due